Method and apparatus for supporting a circuit component having solder column interconnects using external support

ABSTRACT

A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

FIELD OF THE INVENTION

[0001] This invention relates to circuit components mounted on circuitboards by solder column interconnects or arrays, and more particularly,the support of circuit components having column grid arrays.

BACKGROUND OF THE INVENTION

[0002] Solder column interconnects or arrays are used to interconnectcircuit packages to circuit boards, most typically large ceramicintegrated circuit packages. One such package is the column grid array(CGA) integrated circuit package that has a ceramic substrate with anarray of solder columns that extend out from it, typically from thebottom surface. The solder columns are attached at one end to connectionpads or locations on the ceramic substrate. The solder columns aresufficiently tall so that when the circuit package is placed on acircuit board, the solder columns can accommodate the difference inthermal expansion between the ceramic integrated circuit package and theprinted circuit board. The solder columns are soldered to respectivepads on the circuit board using known techniques, such as a convectionreflow solder process.

[0003] One problem with solder column arrays is that the solder columnsdo not withstand compressive force well. The solder columns in thesolder column arrays are typically made of a 90%/10% Pb/Sn solder,making them soft. Moreover, the individual solder columns are very thin.Consequently, if any significant amount of compressive force is appliedto the circuit package, such as might be applied by a cooling solutionsuch as a heat sink or fan, the resulting weight on the circuit packagemay cause the solder column array to compress, particularly over time,which may compromise reliability. In this regard, loads in excess ofabout 10 to 20 grams per column exert sufficient compressive force sothat reliability may be compromised. Since CGA integrated circuitpackages are being increasingly used for high power integrated circuits,the cooling solution required often has considerable mass. It is notunusual for the heat sink or cooling solution used with such high powerintegrated circuits to exceed one pound.

SUMMARY OF THE INVENTION

[0004] In accordance with an aspect of the invention, a circuit boardassembly has a circuit board and an integrated circuit package having asubstrate with an array of solder columns extending from a bottomsurface of the substrate to the circuit board when the integratedcircuit package is mounted on the circuit board. At least one supportmember is affixed to at least one of a side of the substrate and a topsurface of the substrate when the integrated circuit package is mountedto the circuit board. In an aspect of the invention, each support memberis affixed by adhesive after the integrated circuit package is mountedto the circuit board, the adhesive accommodating any variation in heightof the integrated circuit package. The support member or members supportthe integrated circuit package against compressive force.

[0005] In an aspect of the invention, the integrated circuit package isa CGA integrated circuit package.

[0006] In an aspect of the invention, the support member is a frame thatsurrounds the integrated circuit package and is affixed thereto. Atleast a portion of the frame extends from the substrate to a portion ofa circuit board assembly when the column grid array integrated circuitpackage is mounted on the circuit board. The frame supports the columngrid array integrated circuit package against compressive force.

[0007] In an aspect of the invention, the frame includes flanges thatextend over a top surface of the substrate and that are affixed to atleast one of the top surface of the substrate and an outer edge of a lidof the integrated circuit package.

[0008] In an aspect of the invention, the frame is affixed to at leastone of an outer edge of the substrate and the outer edge of the lid.

[0009] In an alternative aspect of the invention, support legs supportthe substrate and have a flange that is affixed to at least one of thetop surface of the substrate and an outer edge of the lid of theintegrated circuit package.

[0010] Further areas of applicability of the present invention willbecome apparent from the detailed description provided hereinafter. Itshould be understood that the detailed description and specificexamples, while indicating the preferred embodiment of the invention,are intended for purposes of illustration only and are not intended tolimit the scope of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present invention will become more fully understood from thedetailed description and the accompanying drawings wherein:

[0012]FIG. 1 a side view of a column grid array integrated circuitpackage mounted on a circuit board and having a support frame inaccordance with the invention;

[0013]FIG. 2 is a perspective view of the support frame of FIG. 1;

[0014]FIG. 3 is a perspective view of support legs in accordance withthe invention;

[0015]FIG. 4 is a side view of an alternative embodiment of a columngrid array integrated circuit package mounted on a circuit board andhaving a support frame in accordance with the invention;

[0016]FIG. 5 is a perspective view of the support frame of FIG. 4;

[0017]FIG. 6 is a perspective view of an alternative embodiment ofsupport legs in accordance with the invention;

[0018]FIG. 7 is a perspective view of an alternative embodiment ofsupport legs in accordance with the invention; and

[0019]FIG. 8 is a perspective view of an alternative embodiment ofsupport legs in accordance with the invention.

DETAILED DESCRIPTION

[0020] The following detailed description is merely exemplary in natureand is in no way intended to limit the invention, its application, oruses.

[0021] Referring to FIG. 1, a circuit board assembly 8 including a CGAintegrated circuit package 10 and circuit board 22 in accordance withthe invention is shown. It should be understood that while the inventionis described with regard to a CGA integrated circuit package, it is notlimited to CGA integrated circuit packages and can be utilized on anycircuit package having solder column interconnects. CGA integratedcircuit package 10 can be a CPU package but can also be other types ofcircuit packages, such as ASICs (application specific integratedcircuits).

[0022] CGA integrated circuit package 10 has a substrate 12, usuallymade of ceramic, and a package lid 14. A solder column array 16 havingan array of solder columns 18 extends from a bottom side 20 of substrate12. When CGA integrated circuit package 10 is mounted on circuit board22, solder columns 18 of solder column array 16 are soldered torespective connection pads 24 on circuit board 22, which isillustratively a printed circuit board.

[0023] A frame 26 is attached to CGA integrated circuit package 10,illustratively, by adhesive 34 disposed between frame 26 and CGAintegrated circuit package 10. Frame 26 is made of material that issufficiently rigid to support CGA integrated circuit package 10 againstcompressive force, such as is imposed by a cooling solution mounted toCGA integrated circuit package 10. For example, frame 26 can be made ofmetal or plastic. Adhesive 34 can be any adhesive suitable for bondingthe material of which frame 26 is made to CGA integrated circuit package10. For example, if frame 26 is made of stainless steel, then an epoxyadhesive could be used, such as 3M DP460 available from Minnesota Miningand Manufacturing, St. Paul, Minn. Illustratively, adhesives such asLoctite 3526 available from Loctite Corporation, Rocky Hills, Conn., ora single part thermoset epoxy such as Ablestik Laboratories 84.3,available from Ablestik Laboratories, Rancho Dominguez, Calif. couldalso be used.

[0024] Turning to FIG. 2, frame 26 is described in more detail. Frame 26illustratively conforms to the shape of CGA integrated circuit package10. In the embodiment shown in FIGS. 1 and 2, CGA integrated circuitpackage 10 is generally square so frame 26 is also generally square.Frame 26 has legs 28 at each corner with span sections 30 extendingbetween adjacent legs 28. A flange 32 extends inwardly from a top ofeach leg 28. In the embodiment shown in FIG. 2, each leg 28 has firstand second segments at right angles to each other as does flange 32.Each leg 28 extends beneath a plane in which bottom side 20 of substrate12 lies and contacts a portion of circuit board 22 so that frame 26supports CGA integrated circuit package 10 against compressive force,such as exerted by a cooling solution mounted on CGA integrated circuitpackage 10. While each leg 28 would typically contact the surface ofcircuit board 22, it should be understood that support structures couldbe provided on circuit board 22 for the legs 28 to contact.

[0025] Frame 26 surrounds CGA integrated circuit package 10 with flanges32 extending over a top surface 13 of substrate 12 so that inner edges42 of flange 32 are adjacent an outer perimeter 15 of package lid 14 ofCGA integrated circuit package 10. Frame 26 is secured to CGA integratedcircuit package 10 by adhesive disposed between a bottom surface 44 offlange 32 and top surface 13 of CGA integrated circuit package 10 and/orbetween inner edges 42 of flange 32 and outer perimeter 15 of packagelid 14.

[0026] Turning to FIG. 3, a variation of the invention shown in FIGS. 1and 2 is shown. In FIG. 3, support sections or legs 36 are used in lieuof frame 26 to support CGA integrated circuit package 10. Supportsections 36 are illustratively corner sections. Each corner section hasa leg section 38, illustratively comprising first and second sections 39at right angles to each other, and an inwardly extending top flange 40,illustratively having flange sections 41 at right angles to each other.Inner edges 42 and bottom surface 44 of top flanges 40 are secured toCGA integrated circuit package 10, such as by adhesive 34.

[0027] Turning to FIGS. 4 and 5, a variation of the invention shown inFIGS. 1 and 2 is shown. In FIG. 4, a frame 46 is provided that isidentical to frame 26 with the omission of top flanges 32. Frame 46 issecured to CGA integrated circuit package 10, such as by adhesive 34disposed between sides 48 of CGA integrated circuit package 10 and innersides 50 of frame 46. As shown in phantom in FIG. 4, lid 14 can extendto the edges of substrate 12 and also be secured to frame 46, such as byadhesive 34.

[0028]FIG. 6 shows a variation of the invention shown in FIGS. 4 and 5where frame 46 is replaced with support sections 52. Support sections 52are illustratively corner sections having legs 54 with first and secondsections 56 at right angles to each other.

[0029]FIG. 7 shows a variation of the invention shown in FIG. 3 whereone or more support sections 58 are used in lieu of or in addition toone or more support sections 36. Each support section 58 comprises anL-shaped section having a leg 60 and a top flange 62 and is secured toCGA integrated circuit package 10 in the same fashion as supportsections 36. For example, each support section 58 is secured to CGAintegrated circuit package 10 by adhesive 34 disposed between a bottomsurface 64 of top flange 62 of support section 58 and top surface 13 ofsubstrate 12 of CGA integrated circuit package 10. Support sections 58,however, can be secured anywhere around CGA integrated circuit package10 and need not be secured to CGA integrated circuit package 10 at thecorners of CGA integrated circuit package 10.

[0030]FIG. 8 shows a variation of the invention of FIG. 6 where one ormore support sections 70 are used in lieu of or in addition to one ormore support sections 52. Each support section 70 is generallyrectangularly shaped and attached to CGA integrated circuit package inthe same fashion as support section 58. Support sections 70, however,can be secured anywhere around CGA integrated circuit package 10 andneed not be secured to CGA integrated circuit package 10 at the cornersof CGA integrated circuit package 10.

[0031] It should be understood that the coefficient of thermal expansion(CTE) of the frame 26, frame 46, or support sections 36, 52, 58, 70 isimportant. In each instance, the CTE of the frame 26, frame 46, orsupport sections 36, 52, 58, 70, whichever are used, should preferablymatch the CTE of the supported CGA integrated circuit package 10 asclosely as possible. The CTE of solder columns 18 is about 27 and thatof ceramic is about 8 ppm/degree C. In the case of frame 26 and supportsections 36 and 58 which are attached above substrate 12, stainlesssteel was found to have a suitable CTE.

[0032] Because of manufacturing tolerances, the height of CGA integratedcircuit package 10 can vary by +/−4 mils. The adhesive attachmentaccommodates the tolerance variations assuring a tight support of CGAintegrated circuit package 10 to circuit board 22. In this regard, frame26, frame 46, or support sections 36, 52, 58, 70, whichever are used,are secured to CGA integrated circuit package 10 after CGA integratedcircuit package 10 has been mounted to circuit board 22, such as by theabove mentioned reflow soldering process.

[0033] The description of the invention is merely exemplary in natureand, thus, variations that do not depart from the gist of the inventionare intended to be within the scope of the invention. Such variationsare not to be regarded as a departure from the spirit and scope of theinvention.

What is claimed is:
 1. A circuit board assembly, comprising: a. acircuit board; b. an integrated circuit package having a substrate withan array of solder columns extending from a bottom surface of thesubstrate to the circuit board when the integrated circuit package ismounted on the circuit board; and c. at least one support member affixedto at least one of a side of the substrate and a top surface of thesubstrate when the integrated circuit package is mounted to the circuitboard.
 2. The apparatus of claim 1 wherein the support member is affixedto the integrated circuit package after the integrated circuit packageis mounted to the circuit board by adhesive, the adhesive accommodatingany variation in height of the integrated circuit package.
 3. Theapparatus of claim 2 wherein the integrated circuit package has a lidaffixed to the substrate, the lid having an outer perimeter that issmaller than an outer perimeter of the substrate, each support memberhaving a flange extending over the upper surface of the substrate, theflange of each support member affixed to at least one of the outer edgesof the lid and the upper surface of the substrate by adhesive.
 4. Theapparatus of claim 3 wherein the support member comprises a framesurrounding the integrated circuit package.
 5. The apparatus of claim 4wherein the frame is rectangular and has a support leg and an inwardlyextending flange at each corner, each support leg having first andsecond segments approximately at right angles to each other and eachflange having first and second segments at approximately right angles toeach other, each flange secured to at least one of the outer edge of thelid and the upper surface of the substrate by adhesive.
 6. The apparatusof claim 7 wherein the flanges are secured to both the outer edge of thepackage lid and the upper surface of the substrate by adhesive.
 7. Theapparatus of claim 3 wherein the integrated circuit package is a columngrid array integrated circuit package.
 8. The apparatus of claim 2wherein the support member comprises a frame surrounding the integratedcircuit package with an inner side of the frame affixed by adhesive toat least one of an outer side of the substrate and an outer edge of alid affixed to the substrate, the adhesive accommodating any variationin height of the integrated circuit package.
 9. The apparatus of claim 2wherein the support member comprises a support leg.
 10. The apparatus ofclaim 9, wherein the integrated circuit package has a lid affixed to thesubstrate, the lid having an outer perimeter that is smaller than anouter perimeter of the substrate, each support leg having a flangeextending over an upper surface of the substrate, each flange affixed toat least one of an outer edge of the lid and the upper surface of thesubstrate by adhesive, the adhesive accommodating any variation inheight of the integrated circuit package.
 11. The apparatus of claim 9wherein the integrated circuit package is rectangular and has a supportleg at each corner.
 12. The apparatus of claim 11, wherein each supportleg is affixed to at least one of an outer edge of a lid affixed to thesubstrate and an outer edge of the substrate by adhesive, the adhesiveaccommodating any variation in height of the integrated circuit package.13. The apparatus of claim 10 wherein the integrated circuit package isa column gird array integrated circuit package.
 14. A circuit boardassembly, comprising: a. a circuit board; b. a column grid arrayintegrated circuit package having a substrate with an array of soldercolumns extending from a bottom surface of the substrate to the circuitboard when the integrated circuit package is mounted on the circuitboard, the integrated circuit package having a lid affixed to thesubstrate, the lid having an outer perimeter that is smaller than anouter perimeter of the substrate; and c. at least one support memberaffixed to at least one of an edge of the lid and a top surface of thesubstrate by adhesive after the column grid array integrated circuitpackage has been mounted to the circuit board, the adhesiveaccommodating any variation in height of the column grid arrayintegrated circuit package.
 15. The apparatus of claim 14, wherein eachsupport member has a flange extending over the upper surface of thesubstrate, the flange of each support member affixed to at least one ofthe outer edge of the lid and the upper surface of the substrate byadhesive.
 16. The apparatus of claim 15 wherein the column grid arrayintegrated circuit package is rectangular and the support membercomprises a rectangular frame extending around the substrate, the framehaving a support leg and an inwardly extending flange at each corner,each support leg having first and second segments approximately at rightangles to each other and each flange having first and second segments atapproximately right angles to each other, each flange secured to atleast one of the outer edge of the lid and the upper surface of thesubstrate by adhesive.
 17. In a circuit board assembly having a circuitboard and an integrated circuit package, the integrated circuit packagehaving a substrate with an array of solder columns extending from abottom surface of the substrate to the circuit board, a method ofsupporting the integrated circuit package against compressive force,comprising the step of affixing at least one support member to at leastone of a side and a top of the substrate after the integrated circuitpackage has been mounted on the circuit board, the support member havingat least a portion that extends from the substrate to the circuit board.18. The method of claim 17 wherein the step of affixing the at least onesupport member includes providing a support member having flanges thatextend over a portion of a top of the substrate when the support memberis affixed to the at least one of the side and top of the substrate andaffixing the flanges to the top of the substrate by adhesive, theadhesive accommodating any variation in height of the integrated circuitpackage.
 19. The method of claim 17 wherein the step of providing thesupport member includes providing a support member comprising a framethat extends around the substrate and affixing the frame affixed to thesubstrate by adhesive, the adhesive accommodating any variation inheight of the integrated circuit package.
 20. The method of claim 17wherein the step of affixing the at least one support member includesproviding at least one support member comprising a support leg andaffixing the support leg to the integrated circuit package by adhesive,the adhesive accommodating any variation in height of the integratedcircuit package.
 21. The method of claim 20 wherein the step ofproviding at least one support member comprises providing at least foursupport members spaced equidistantly around a periphery of thesubstrate.